DocumentCode
501884
Title
Voltage raised in Al2 O3 gap of GMR head in the deshunting process
Author
Siritaratiwat, A. ; Suwannata, N. ; Pinnoi, J. ; Pupaichitkul, C.
Author_Institution
Dept. of Electr. Eng., Khon Kaen Univ., Khon Kaen, Thailand
fYear
2001
fDate
11-13 Sept. 2001
Firstpage
298
Lastpage
303
Abstract
In the process of HGA fabrication, a shunting process is performed in order to prevent the ESD effect but when an HGA is required for another process the shunt tab has to be trimmed. This process is thought to cause the damage of GMR heads at the Al2O3 gap between the shunt tab and the substrate. The simulated and measured results are compared to investigate this possibility.
Keywords
electrostatic discharge; giant magnetoresistance; Al2O3; ESD effect; GMR head; HGA fabrication; deshunting process; electrostatic discharge; giant magnetoresistance; Biological system modeling; Capacitance; Electrical resistance measurement; Electrostatic discharge; Fabrication; Humans; Immune system; Switches; Testing; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Overstress/Electrostatic Discharge Symposium, 2001. EOS/ESD '01.
Conference_Location
Portland, OR
Print_ISBN
978-1-5853-7039-9
Electronic_ISBN
978-1-5853-7039-9
Type
conf
Filename
5254955
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