New plasma cleaning technology

Plasma cleaning technology is used for different applications in backend packaging applications. Plasma cleaning is used to improve capability and performance of: (a) wirebonding (etching) (b) thermosonic flipchip (etching) (c) underfill (surface activation) This presentation sets focus on individual process solutions how to improve those backend processes. Different demands on process and equipment come from different applications. Both etching and surface activation and their special solutions are described. Some mathematical simulations are described. Effect of special gas additive to improve underfill cleaning process results is shown. Challenges for underfill with large die and small gap and underneath the die are shown and solutions explained. Challenges for bondpad cleaning by Argon etching for wirebonding and GGI flipchip are shown and solutions explained. Methods of process and surface analysis like Auger analysis and contact angle measurement and others will be described.