DocumentCode
503126
Title
Experimental study of polymers as encapsulating materials for photovoltaic modules
Author
Sala, S.A. ; Campaniello, M. ; Bailini, A.
Author_Institution
Mater. Lab., Services for Electron. Manuf., Vimercate, Italy
fYear
2009
fDate
15-18 June 2009
Firstpage
1
Lastpage
7
Abstract
Due to the introduction in the market of new generations of photovoltaic (PV) modules, there is the need to develop improved packaging materials. A reliable encapsulating layer is required to guarantee outdoor operation for more than twenty years, paying attention to factors like protection from weather agents and humidity, promotion of the adhesion between the active layer and the substrate, and electrical isolation. The most popular encapsulant is a thermoplastic polymer called ethylene-vinyl acetate (EVA), which is produced in rolls of extruded thick film. Anyway, another material, poly-vinyl butyral (PVB), seems to be the best choice to satisfy the more demanding mechanical and safety requests in the field of building integrated photovoltaic (BIPV). This is one of the reasons why PVB is nowadays widely used with thin film PV, while EVA is still the standard material for crystalline modules. The success of the qualification campaign of a PV module can strongly depend on the performances of the packaging polymer. Many tests can be done to determine the material properties and predict its behaviour under stress conditions. In this work, we are performing an experimental study to test different formulations of polymers as interlayer materials for PV modules. The mechanical properties are one of our focus. They strongly depend on the temperature and the loading intensity because of the thermoplastic nature of these polymers. They deeply affect the reliability of the modules and determine their application.
Keywords
encapsulation; internal stresses; modules; packaging; photovoltaic effects; polymer films; reliability; building integrated photovoltaics; crystalline modules; encapsulating materials; ethylene-vinyl acetate; extruded thick film; interlayer materials; mechanical property; packaging materials; photovoltaic modules; poly-vinyl butyral; reliability; stress; thermoplastic polymer; Adhesives; Building integrated photovoltaics; Humidity; Materials testing; Packaging; Photovoltaic systems; Polymer films; Protection; Solar power generation; Substrates; EVA; PVB; encapsulant; glass transition temperature; photovoltaic; reliability;
fLanguage
English
Publisher
ieee
Conference_Titel
Microelectronics and Packaging Conference, 2009. EMPC 2009. European
Conference_Location
Rimini
Print_ISBN
978-1-4244-4722-0
Electronic_ISBN
978-0-6152-9868-9
Type
conf
Filename
5272888
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