DocumentCode
503147
Title
Compression molding solutions for various high end package and cost savings for standard package applications
Author
Matsutani, Hiroshi
Author_Institution
Towa Corp., Kyoto, Japan
fYear
2009
fDate
15-18 June 2009
Firstpage
1
Lastpage
4
Abstract
There has been great progress on compression molding technology and equipment. This technology is used not only for most advanced semiconductor package, but also regular BGA type substrate molding to reduce CoO. There is wide range of applications including LED production. The system for mass production is fully developed and is ready to support the production. Compression molding is the next Defacto standard product in mold industry.
Keywords
ball grid arrays; compression moulding; light emitting diodes; substrates; Defacto standard product; LED production; compression molding solutions; cost savings; high end package; mold industry; regular BGA type substrate molding; semiconductor package; Compression molding; Computer networks; Costs; Digital systems; Distributed computing; Electronics packaging; Finite element methods; Materials reliability; Shape; Tensile stress;
fLanguage
English
Publisher
ieee
Conference_Titel
Microelectronics and Packaging Conference, 2009. EMPC 2009. European
Conference_Location
Rimini
Print_ISBN
978-1-4244-4722-0
Electronic_ISBN
978-0-6152-9868-9
Type
conf
Filename
5272909
Link To Document