New packaging technology enabling integration of magnetics and semiconductors in one component

The continuous trend towards convergence and miniaturization is recently generating significant interest in new technologies for electronics. This requires the integration of semiconductors and magnetics, two entirely different industries with different players in the value chain. In this paper, we demonstrate, a packaging technology which allows three dimensional stacking of magnets and semiconductors. We realized the integration of a semiconductor chip - which provides protection against electro static discharge (ESD) - and a common mode filter (CMF) into one thermoplastic package. For the first time ever, this filter is integrated directly into the thermoplastic part which is used as the substrate, filter and housing at the same time. Laser direct structuring in combination with Stanyl^reg ForTii^trade as an ultra high performance, entirely halogen high temperature thermoplastic does omit any wires for the realized coil, and also facilitates high flexibility in design and manufacturing, allowing ultra small footprints and the realization of components suitable for surface mount technology. As an example of this new technology, we demonstrate a component which can provide full ESD protection and common mode filtering for a high speed USB2.0 interface.