Mechanical and microstructural properties of SiC-mixed Sn-Bi composite solder bumps by electroplating

Author

Shin, Yue-Seon ; Lee, Sehyung ; Yoo, Sehoon ; Lee, Chang-Woo

Author_Institution

Micro-Joining Center, Korea Inst. of Ind. Technol., Incheon, South Korea

fYear

2009

fDate

15-18 June 2009

Firstpage

1

Lastpage

4

Abstract

SiC-nanoparticle-mixed Sn58Bi solders were successfully produced by electroplating and the mechanical and microstructural properties of Sn58Bi+SiC solders were observed and analyzed in this study. Dispersed SiC nanoparticles by ultrasonic horn were added into Sn-Bi plating solution. With the SiC added Sn-Bi plating solution, solder bumps were electroplated. After electroplating, the solder bump specimens were aged up to 400 hrs at 100degC. The melting temperature of SiC-mixed Sn-58Bi solder was same as non-mixed Sn-58Bi. The shear strength of Sn58Bi+SiC solder bumps increased by 6% as compared with Sn58Bi solder bumps. The thicknesses of intermetallic compound were almost same for both Sn58Bi and Sn58Bi+SiC samples. The Sn58Bi+SiC solder bumps had finer eutectic structures and grain sizes than Sn-Bi without SiC nanoparticles. From the fracture surface analysis, fracture occurred at solder side not at the joint interface. Therefore, the shear strength values represent the solder materials itself and the finder microstructure of Sn58Bi+SiC improved the shear strength.

Keywords

alloys; bismuth alloys; composite materials; electroplating; nanoparticles; silicon alloys; solders; tin alloys; SiC; Sn-Bi; composite solder bumps; electroplating; intermetallic compound; mechanical properties; microstructural properties; nanoparticles; shear strength; ultrasonic horn; Aging; Dielectric substrates; Electronic packaging thermal management; Flip chip; Mechanical factors; Microstructure; Nanoparticles; Silicon carbide; Soldering; Temperature; Electroplating; Pb-free solders; SiC nanoparticles; Sn-58Bi; Solder bump;

fLanguage

English

Publisher

ieee

Conference_Titel

Microelectronics and Packaging Conference, 2009. EMPC 2009. European

Conference_Location

Rimini

Print_ISBN

978-1-4244-4722-0

Electronic_ISBN

978-0-6152-9868-9

Type

conf

Filename

5272966