Thermo-mechanical aspects of reliability for vertically integrated Heterogeneous systems

Author

Janczyk, Grzegorz ; Bieniek, Tomasz ; Grabiec, Piotr ; Szynka, Jerzy

Author_Institution

Dept. of Integrated Circuits & Syst., Inst. of Electron Technol., Warsaw, Poland

fYear

2009

fDate

25-27 June 2009

Firstpage

536

Lastpage

540

Abstract

Vertical device integration is one of the promising device fabrication trends. Heterogeneous device technology research and development faces with new post-fabrication thermo-mechanical problems. Apart from the heat dissipation, temperature dependent mechanical stress spreads across the device affecting its performance. This paper discusses selected stress related device performance and reliability issues.

Keywords

cooling; integrated circuit manufacture; integrated circuit reliability; device fabrication trends; heat dissipation; heterogeneous device technology research and development; heterogeneous systems; post-fabrication thermo-mechanical problems; reliability thermo-mechanical aspects; temperature dependent mechanical stress; vertical device integration; Corona; Electrons; Fabrication; Integrated circuit technology; Optimized production technology; Reliability engineering; Research and development; Silicon; Stress; Thermomechanical processes; Coventor; Matlab; Multidomain simulations; Reliability; Sensivity; Stress modeling;

fLanguage

English

Publisher

ieee

Conference_Titel

Mixed Design of Integrated Circuits & Systems, 2009. MIXDES '09. MIXDES-16th International Conference

Conference_Location

Lodz

Print_ISBN

978-1-4244-4798-5

Electronic_ISBN

978-83-928756-1-1

Type

conf

Filename

5289628