Title :
Characterization of Micromachined On-Wafer Probes for the 600–900 GHz Waveguide Band
Author :
Bauwens, Matthew F. ; Lihan Chen ; Chunhu Zhang ; Arsenovic, Alexander I. ; Alijabbari, Naser ; Lichtenberger, Arthur W. ; Barker, N.S. ; Weikle, Robert M.
Author_Institution :
Charles L. Brown Dept. of Electr. & Comput. Eng., Univ. of Virginia, Charlottesville, VA, USA
Abstract :
A micromachined on-wafer probe has been designed to facilitate the development of integrated circuits in the 600-900 GHz frequency range. The probe tip is fabricated on a 5-micrometer thick high-resistivity silicon substrate using a silicon-on- insulator fabrication process. This letter updates previous work on WR-1.2 wafer probes and presents for the first time the full RF characterization of the probe. These are the first reported on-wafer measurements above 750 GHz.
Keywords :
micromachining; silicon-on-insulator; submillimetre wave integrated circuits; waveguides; WR-1.2 wafer probes; frequency 600 GHz to 900 GHz; full RF characterization; high-resistivity silicon substrate; integrated circuits; micromachined on-wafer probe characterization; on-wafer measurements; silicon-on-insulator fabrication process; size 5 mum; waveguide band; Calibration; Coplanar waveguides; Loss measurement; Optical waveguides; Probes; Waveguide transitions; Micromachining; probes; submillimeter wave measurements; submillimeter-wave integrated circuits;
Journal_Title :
Terahertz Science and Technology, IEEE Transactions on
DOI :
10.1109/TTHZ.2014.2327381
