DocumentCode
50522
Title
Gate Oxide Reliability Issues of SiC MOSFETs Under Short-Circuit Operation
Author
Thanh-That Nguyen ; Ahmed, Arif ; Thang, T.V. ; Joung-hu Park
Author_Institution
Dept. of Electr. Eng., Soongsil Univ., Seoul, South Korea
Volume
30
Issue
5
fYear
2015
fDate
May-15
Firstpage
2445
Lastpage
2455
Abstract
Silicon-Carbide (SiC) MOSFETs, due to material properties, are designed with smaller thickness in the gate oxide and a higher electric field compared to Si MOSFETs. Consequently, the SiC MOSFETs have a worse reliability which causes higher leakage currents during instantaneous abnormal operating conditions. This paper investigates the reliability issues of the SiC MOSFET gate oxide under standard short-circuit test conditions. In this paper, 1200-V SiC MOSFETs are newly modeled, and also their short-circuit sustainability (tolerance) have been studied at different drain-source and gate-source voltages. A hardware tester circuit was designed and developed to test the devices under such extreme circuit conditions. Then, the gate reliability of SiC MOSFET devices have been compared to that of Si power devices of similar ratings. The results reveal a higher reduction in the instantaneous gate-source voltage of SiC MOSFETs compared to that of Si devices under the same operating conditions. The gate-voltage reduction phenomenon results from the higher leakage currents through the gate. Furthermore, it was found that the gate-source voltage reduction during the test depends on the gate structures. The gate voltage reduction of SiC MOSFETs with planar gate is higher than that of MOSFETs with shield planar gate. As the pulse duration increases in short-circuit tests, the leakage current in the gate-source of SiC devices increases. The results show that even though the SiC MOSFETs are very capable of processing long pulses and high power in the drain-source, the gate-source side is highly degraded by these pulses in the test. Moreover, whenever a small number of the short-circuit tests are applied, the gate structure of SiC MOSFETs becomes broken while the drain-source is still able to block the dc-link voltage. The paper concludes that the short-circuit reliability of the gate was found to be worse compared with commercial Si devices with similar rating.
Keywords
MOSFET; integrated circuit testing; semiconductor device reliability; SiC; gate oxide reliability; gate-source voltage reduction; hardware tester circuit; short-circuit operation; short-circuit reliability; short-circuit sustainability; silicon-carbide MOSFET; voltage 1200 V; Electric fields; Integrated circuit reliability; Logic gates; MOSFET; Silicon; Silicon carbide; Gate leakage current; SiC MOSFET; gate oxide reliability; short-circuit test;
fLanguage
English
Journal_Title
Power Electronics, IEEE Transactions on
Publisher
ieee
ISSN
0885-8993
Type
jour
DOI
10.1109/TPEL.2014.2353417
Filename
6888511
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