Reliable electrical interconection for fluidic glass bio-chip to macro world

This paper reports a demonstrator for electrical interconnection of a fluidic glass bio-chip to the macro world. Our assay used a patterned kapton 8 mum copper-plated, with 8 electrical lines placed at a 2.54 mm pitch. Filling the holes provided through the kapton foil with Ag-epoxy resin did the electrical connection between metallic lines on glass and the corresponding copper lines on the top of kapton. Subsequently, the kapton was glued on both sides of glass chip with silicon rubber, resulting a sandwich with total thickness of 1.7 mm, well suited to fit into standard 2.54 mm pitch mother-socket.