DocumentCode
505452
Title
On the speed of symbolic network analysis of Joule heating in ic interconnects
Author
Liao, Chiun-Shen ; Labun, Andrew ; Milani, Abbas S.
Author_Institution
School of Engineering, University of British Columbia Okanagan, 3333 University Way, Kelowna, Canada V1V 3T1
fYear
2009
fDate
13-14 Oct. 2009
Firstpage
13
Lastpage
16
Abstract
Simulation of the temperature distribution in a regular IC interconnect network is achieved by means of an analytical-symbolic approach. Analytical Joule heating solutions along each interconnect can provide accurate solutions with far fewer nodes than numerical solutions. Multiple evaluations, including iterating temperature-dependent thermal conductivity to achieve a self-consistent solution, scale linearly with the number of nodes and hardly affect the total solution time. The necessary input information is contained in commented netlist files, similar to SPICE input format. Memory consumption, CPU time, and solutions of the new network calculation method compare favourably to a finite element analysis using Abaqus.
Keywords
Joule self-heating; integrated circuit interconnects; thermal modeling;
fLanguage
English
Publisher
iet
Conference_Titel
Microsystems and Nanoelectronics Research Conference, 2009. MNRC 2009. 2nd
Conference_Location
Ottawa, ON, Canada
Print_ISBN
978-1-4244-4751-0
Type
conf
Filename
5338971
Link To Document