• DocumentCode
    505452
  • Title

    On the speed of symbolic network analysis of Joule heating in ic interconnects

  • Author

    Liao, Chiun-Shen ; Labun, Andrew ; Milani, Abbas S.

  • Author_Institution
    School of Engineering, University of British Columbia Okanagan, 3333 University Way, Kelowna, Canada V1V 3T1
  • fYear
    2009
  • fDate
    13-14 Oct. 2009
  • Firstpage
    13
  • Lastpage
    16
  • Abstract
    Simulation of the temperature distribution in a regular IC interconnect network is achieved by means of an analytical-symbolic approach. Analytical Joule heating solutions along each interconnect can provide accurate solutions with far fewer nodes than numerical solutions. Multiple evaluations, including iterating temperature-dependent thermal conductivity to achieve a self-consistent solution, scale linearly with the number of nodes and hardly affect the total solution time. The necessary input information is contained in commented netlist files, similar to SPICE input format. Memory consumption, CPU time, and solutions of the new network calculation method compare favourably to a finite element analysis using Abaqus.
  • Keywords
    Joule self-heating; integrated circuit interconnects; thermal modeling;
  • fLanguage
    English
  • Publisher
    iet
  • Conference_Titel
    Microsystems and Nanoelectronics Research Conference, 2009. MNRC 2009. 2nd
  • Conference_Location
    Ottawa, ON, Canada
  • Print_ISBN
    978-1-4244-4751-0
  • Type

    conf

  • Filename
    5338971