DocumentCode
507385
Title
An electrical-level superposed-edge approach to statistical serial link simulation
Author
Tsuk, Michael ; Dvorscak, Daniel ; Ong, Chin Siong ; White, Jacob
Author_Institution
Ansoft LLC, Burlington, MA, USA
fYear
2009
fDate
2-5 Nov. 2009
Firstpage
717
Lastpage
724
Abstract
Brute-force simulation approaches to estimating serial-link bit-error rates (BERs) become computationally intractable for the case when BERs are low and the interconnect electrical response is slow enough to generate intersymbol interference that spans dozens of bit periods. Electrical-level statistical simulation approaches based on superposing pulse responses were developed to address this problem, but such pulse-based methods have difficulty analyzing jitter and rise/fall asymmetry. In this paper we present a superposing-edge approach for statistical simulation, as edge-based methods handle rise/fall asymmetry and jitter in straightforward way. We also resolve a key problem in using edge-based approaches, that edges are always correlated, by deriving an efficient inductive approach for propagating the edge correlations. Examples are presented demonstrating the edge-based method´s accuracy and effectiveness in analyzing combinations of uniform, Gaussian, and periodic distributed random jitter.
Keywords
error statistics; intersymbol interference; jitter; signal processing; brute force simulation approach; electrical level statistical simulation approach; electrical level superposed edge approach; intersymbol interference; jitter asymmetry; pulse based method; rise/fall asymmetry; serial link bit error rate; statistical serial link simulation; superposing edge approach; superposing pulse response; Analytical models; Bit error rate; Computational modeling; Costs; Integrated circuit interconnections; Intersymbol interference; Jacobian matrices; Jitter; Permission; Transmitters; Bit-Error Rate; Circuit Simulation; Eye Diagrams; Interconnect; Serial Link;
fLanguage
English
Publisher
ieee
Conference_Titel
Computer-Aided Design - Digest of Technical Papers, 2009. ICCAD 2009. IEEE/ACM International Conference on
Conference_Location
San Jose, CA
ISSN
1092-3152
Print_ISBN
978-1-60558-800-1
Electronic_ISBN
1092-3152
Type
conf
Filename
5361218
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