• DocumentCode
    507392
  • Title

    Energy-optimal dynamic thermal management for green computing

  • Author

    Shin, Donghwa ; Kim, Jihun ; Chang, Naehyuck ; Choi, Jinhang ; Chung, Sung Woo ; Chung, Eui-Young

  • Author_Institution
    Seoul Nat. Univ., Seoul, South Korea
  • fYear
    2009
  • fDate
    2-5 Nov. 2009
  • Firstpage
    652
  • Lastpage
    657
  • Abstract
    Existing thermal management systems for microprocessors assume that the thermal resistance of the heat-sink is constant and that the objective of the cooling system is simply to avoid thermal emergencies. But in fact the thermal resistance of the usual forced-convection heat-sink is inversely proportional to the fan speed, and a more rational objective is to minimize the total power consumption of both processor and cooling system. Our new method of dynamic thermal management uses both the fan speed and the voltage/frequency of the microprocessor as control variables. Experiments show that tracking the energy-optimal steady-state temperature can saves up to 17.6% of the overall energy, when compared with a conventional approach that merely avoids overheating.
  • Keywords
    cooling; heat sinks; microprocessor chips; power consumption; thermal management (packaging); thermal resistance; cooling system; dynamic thermal management; energy-optimal steady-state temperature; green computing; heat sink; microprocessors; power consumption; thermal resistance; Cooling; Disaster management; Energy consumption; Energy management; Microprocessors; Power system management; Resistance heating; Thermal force; Thermal management; Thermal resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computer-Aided Design - Digest of Technical Papers, 2009. ICCAD 2009. IEEE/ACM International Conference on
  • Conference_Location
    San Jose, CA
  • ISSN
    1092-3152
  • Print_ISBN
    978-1-60558-800-1
  • Electronic_ISBN
    1092-3152
  • Type

    conf

  • Filename
    5361225