DocumentCode
510004
Title
The era of many-modules SoC: revisiting the NoC mapping problem
Author
Walter, Isask´har ; Cidon, Israel ; Kolodny, Avinoam ; Sigalov, Daniel
Author_Institution
Dept. of Electr. Eng., Technion - Israel Inst. of Technol., Haifa, Israel
fYear
2009
fDate
12-12 Dec. 2009
Firstpage
43
Lastpage
48
Abstract
Due to technology scaling, it is expected that future chips would integrate tens to hundreds of functional units. The growing power and design costs limit the benefit of continuously increasing the universality and complexity of these units and motivate the usage of specialized hardware modules. These modules are likely to be replicated in order to exploit the inherent parallelism of many tasks. This trend already exists in CMPs (moving from multi-core to many-cores), ASSPs and FPGAs. In this paper, we revisit the network on-chip (NoC) mapping problem in light of this expected trend. Specifically, we leverage the use of on-chip replicated specialized modules to minimize traffic and hence to reduce the power consumed by the NoC. We further improve the interconnect efficiency by making the mapping algorithm aware of the set of modules traversed by application data. To this end, we present an enhanced modeling of the resources and timing requirements within a system on-chip (SoC). We evaluate the benefit of the proposed approach and show a significant reduction in the cost of communication.
Keywords
integrated circuit interconnections; integrated circuit layout; integrated circuit packaging; modules; network-on-chip; system-on-chip; NoC mapping; interconnection efficiency; many module SoC; mapping algorithm; network-on-chip mapping; technology scaling; Costs; Field programmable gate arrays; Hardware; Network-on-a-chip; Power system interconnection; Power system modeling; System-on-a-chip; Telecommunication traffic; Timing; Traffic control; Mapping; Network on-Chip; Optimization; System on-Chip;
fLanguage
English
Publisher
ieee
Conference_Titel
Network on Chip Architectures, 2009. NoCArc 2009. 2nd International Workshop on
Conference_Location
New York, NY
Print_ISBN
978-1-60558-774-5
Type
conf
Filename
5375714
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