• DocumentCode
    511362
  • Title

    Low temperature wiring with Ag inks: New β-ketocarboxylate Ag inks for 100 °C curing

  • Author

    Kawazome, Mitsuru ; Kim, Keun-Soo ; Suganuma, Katsuaki

  • Author_Institution
    Central Res. Center, Toppan Forms Co., Ltd., Hachioji, Japan
  • fYear
    2009
  • fDate
    26-30 July 2009
  • Firstpage
    4
  • Lastpage
    6
  • Abstract
    This paper summarizes a Ag carboxylate ink technology for patterning circuits on heat-sensitive substrates. Low temperature processes for making circuits is becoming one of the key issues for printed electronics primarily because of the potentials of heat-sensitive substrates such as PET films and papers. The authors have developed ß-ketocarboxylate Ag inks that can be cured around 100°C. The electrical specifications and microstructural observations of the new ink printed on commercial papers are demonstrated.
  • Keywords
    curing; ink; nanopatterning; organic compounds; polymer films; printed circuits; substrates; wiring; Ag carboxylate ink technology; PET films; curing; heat-sensitive substrates; low temperature wiring; microstructure; papers; printed electronics; temperature 100 C; Ã\x9f-ketocarboxylate Ag inks; Circuits; Costs; Curing; Ink; Inorganic materials; Nanoparticles; Positron emission tomography; Temperature; Water; Wiring; β-ketocarboxylate Ag ink; ink-jet printing; printed electronics; wiring;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nanotechnology, 2009. IEEE-NANO 2009. 9th IEEE Conference on
  • Conference_Location
    Genoa
  • ISSN
    1944-9399
  • Print_ISBN
    978-1-4244-4832-6
  • Electronic_ISBN
    1944-9399
  • Type

    conf

  • Filename
    5394548