FEM simulation of bimodal and trimodal thermally conductive adhesives

Author

Nabiollahi, Nabi ; Liu, Johan ; Hilli, Zhu ; Zhang, Yan ; Cong, Yue ; Cheng, Zhaonian ; Inoue, Masahiro

Author_Institution

Dept. of Microtechnol. & Nanosci., Univ. of Technol., Gothenburg, Sweden

fYear

2009

fDate

26-30 July 2009

Firstpage

422

Lastpage

425

Abstract

A simulation with combination of a finite element analysis of Thermally Conductive Adhesive and contact resistance modeling has been presented. Using ANSYS and MATLAB software thermal conductivity and electrical resistivity of Conductive Adhesives with Ag filler and Epoxy matrix has been calculated. Thermally Conductive Adhesives are used as a thermal interface material to provide a better conduction and heat transfer between two surfaces. The results show that the conductivity dependency is relatively high for different filler shape and alignment. Discussed models are bimodal, Ag flakes and Ag spherical micro particles and trimodal with Multi-WallCNT nano particles.

Keywords

adhesives; contact resistance; finite element analysis; heat conduction; thermal conductivity; ANSYS; Ag; FEM simulation; MATLAB software; bimodal thermally conductive adhesives; contact resistance modeling; cubic cell method; electrical resistivity; epoxy matrix; filler alignment; filler shape; finite element analysis; heat conduction; heat transfer; thermal conductivity; thermal interface material; trimodal thermally conductive adhesives; Analytical models; Conducting materials; Conductive adhesives; Contact resistance; Electric resistance; Finite element methods; MATLAB; Mathematical model; Thermal conductivity; Thermal resistance;

fLanguage

English

Publisher

ieee

Conference_Titel

Nanotechnology, 2009. IEEE-NANO 2009. 9th IEEE Conference on

Conference_Location

Genoa

ISSN

1944-9399

Print_ISBN

978-1-4244-4832-6

Electronic_ISBN

1944-9399

Type

conf

Filename

5394680