Time-dependent sintering properties of Ag nanoparticle paste for room temperature bonding

Author

Wakuda, Daisuke ; Kim, Keun-Soo ; Suganuma, Katsuaki

Author_Institution

Dept. of Adaptive Machine Syst., Osaka Univ., Suita, Japan

fYear

2009

fDate

26-30 July 2009

Firstpage

412

Lastpage

415

Abstract

Time-dependent sintering properties of Ag nanoparticle paste for room temperature bonding were investigated. Ag nanoparticle paste with a small amount of alkylamine dispersant can sinter at room temperature by the evaporation of toluene solvent. When the solvent evaporates, sintering with neck growth and the coalescence of particles is initiated within half an hour and the Ag grain continues to grow gradually for hours. Furthermore, a time-dependent change in the shear strength is demonstrated using a bonding test with Cu plates at room temperature. Bonding between the Ag paste and a Cu plate is favorable and fracturing occurs within the sintered Ag body. The strength of sintered Ag increases with sintering time. The shear strength is more than 8 MPa after 6 and 12 h of drying.

Keywords

bonding processes; evaporation; fracture; nanoparticles; shear strength; silver; sintering; Ag; alkylamine dispersant; bonding test; coalescence; drying; evaporation; nanoparticle paste; room temperature bonding; shear strength; sintering time; time 12 h; time 6 h; time-dependent sintering properties; toluene solvent; Bonding; Inorganic materials; Methanol; Nanoparticles; Solvents; Spectroscopy; Stability; Temperature; Testing; X-ray diffraction; Ag; nanoparticles; room temperature; sintering;

fLanguage

English

Publisher

ieee

Conference_Titel

Nanotechnology, 2009. IEEE-NANO 2009. 9th IEEE Conference on

Conference_Location

Genoa

ISSN

1944-9399

Print_ISBN

978-1-4244-4832-6

Electronic_ISBN

1944-9399

Type

conf

Filename

5394685