• DocumentCode
    512650
  • Title

    Mixed mode simulation of heavy ion impact on 3D SRAM cell

  • Author

    Rathod, S.S. ; Saxena, A.K. ; Dasgupta, S.

  • Author_Institution
    Indian Inst. of Technol. Roorkee, Roorkee, India
  • fYear
    2009
  • fDate
    14-16 Dec. 2009
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    Scaling made the semiconductor devices more susceptible to the impact of heavy ion bombardment. Electronic devices used in extraterrestrial space for military and communication purposes can be extremely vulnerable to high concentrations of heavy ions in the outer atmosphere. The impact of heavy ions can induce unwanted changes in the data state by flipping the output nodes of the SRAM cell. The objective of this paper is to study the impact of heavy ions on the data state of the SRAM cell. Key feature is the simulation of a 6T SRAM cell as a single contiguous block of silicon, demonstrating a true 3D mixed-mode simulation capability. Upset probability changes with variation in the characteristic distance of the heavy ion strike. Process and device mixed mode simulations are carried out.
  • Keywords
    SRAM chips; ion beam effects; 3D SRAM Cell; 3D mixed mode simulation; electronic devices; heavy ion bombardment; heavy ion strike characteristic distance; semiconductor devices; upset probability; Atmospheric modeling; Circuits; Computational modeling; Cosmic rays; Implants; Ionizing radiation; Random access memory; Silicon; Single event upset; Space technology; Heavy Ion; Radiation Hardened; SRAM; Simulation; Single Event Upset;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computers and Devices for Communication, 2009. CODEC 2009. 4th International Conference on
  • Conference_Location
    Kolkata
  • Print_ISBN
    978-1-4244-5073-2
  • Type

    conf

  • Filename
    5407216