• DocumentCode
    513794
  • Title

    Large-Area ACTFEL Device Prepared by Metalorganic Chemical Vapor Deposition

  • Author

    Su, S.H. ; Tsai, P.R. ; Yokoyama, M. ; Su, Y.K.

  • Author_Institution
    Department of Electrical Engineering, National Cheng Kung University, 1 University Road, Tainan, Taiwan, R. O. C.
  • fYear
    1995
  • fDate
    25-27 Sept. 1995
  • Firstpage
    743
  • Lastpage
    746
  • Abstract
    ZnS thin film with a large area of 19×13cm2 has been grown by the low pressure MOCVD system in order to study large area TFEL devices. The uniformities of the thickness and crystallinity of the large area ZnS thin film have been studied as functions of the flow rate of H2 and the slit of inlet nozzles. An uniform large area ZnS thin film not only in thickness but also in crystallinity has been obtained by a two-step deposited method. The variance of the film thickness has been controlled below ±3%. The ratio of S/Zn is close to unity evaluated by the measurement of EPMA. An ACTFEL device with a double insulating layer structure (glass/ITO /Ta2O5/ZnS:Mn/Ta2O5/Al) has been fabricated. The luminescence is higher than that of the other reports, which use the same Mn source.
  • Keywords
    Chemical vapor deposition; Crystallization; Glass; Insulation; MOCVD; Sputtering; Thickness control; Thin film devices; Transistors; Zinc compounds;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid State Device Research Conference, 1995. ESSDERC '95. Proceedings of the 25th European
  • Conference_Location
    The Hague, The Netherlands
  • Print_ISBN
    286332182X
  • Type

    conf

  • Filename
    5436114