DocumentCode
513794
Title
Large-Area ACTFEL Device Prepared by Metalorganic Chemical Vapor Deposition
Author
Su, S.H. ; Tsai, P.R. ; Yokoyama, M. ; Su, Y.K.
Author_Institution
Department of Electrical Engineering, National Cheng Kung University, 1 University Road, Tainan, Taiwan, R. O. C.
fYear
1995
fDate
25-27 Sept. 1995
Firstpage
743
Lastpage
746
Abstract
ZnS thin film with a large area of 19Ã13cm2 has been grown by the low pressure MOCVD system in order to study large area TFEL devices. The uniformities of the thickness and crystallinity of the large area ZnS thin film have been studied as functions of the flow rate of H2 and the slit of inlet nozzles. An uniform large area ZnS thin film not only in thickness but also in crystallinity has been obtained by a two-step deposited method. The variance of the film thickness has been controlled below ±3%. The ratio of S/Zn is close to unity evaluated by the measurement of EPMA. An ACTFEL device with a double insulating layer structure (glass/ITO /Ta2 O5 /ZnS:Mn/Ta2 O5 /Al) has been fabricated. The luminescence is higher than that of the other reports, which use the same Mn source.
Keywords
Chemical vapor deposition; Crystallization; Glass; Insulation; MOCVD; Sputtering; Thickness control; Thin film devices; Transistors; Zinc compounds;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid State Device Research Conference, 1995. ESSDERC '95. Proceedings of the 25th European
Conference_Location
The Hague, The Netherlands
Print_ISBN
286332182X
Type
conf
Filename
5436114
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