DocumentCode
513982
Title
Electrical Properties of Ultra Thin Multilayer Dielectrics on Polysilicon
Author
Hirschler, J. ; Thanh, L.Do ; Küsters, K.H. ; Sichart, K.v.
Author_Institution
Siemens AG, Dept. HL T 111, 8000 Mÿnchen 83, Otto-Hahn-Ring 6, West Germanny
fYear
1989
fDate
11-14 Sept. 1989
Firstpage
357
Lastpage
360
Abstract
We demonstrate the feasibility of very thin ONO (SiO2 /Si3 N4 /SiO2 ) dielectrics on poly-Si for 16M DRAM application. For Dox eff. = 8.5nm, the leakage current density is lower than 10-8A/cm2, and the long term stability is more than 10 years at electric fields of 5.5MV/cm. The onset of tunneling current in ONO dielectrics depends on the thickness of the SiO2 entry potential barrier. The high field current characteristic depends on the thickness of the SiO2 exit potential barrier.
Keywords
Current density; Current measurement; Density measurement; Dielectric measurements; Nonhomogeneous media; Random access memory; Semiconductor films; Stress measurement; Thickness measurement; Time measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid State Device Research Conference, 1989. ESSDERC '89. 19th European
Conference_Location
Berlin, Germany
Print_ISBN
0387510001
Type
conf
Filename
5436594
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