DocumentCode :
514103
Title :
Comparison of Methods Characterizing Time Dependent Dielectric Breakdown in Thin Oxide and Oxide-Nitride-Oxide Layers
Author :
Hiergeist, P. ; Kerber, M. ; Baunach, R. ; Spitzer, A.
Author_Institution :
Siemens AG, Corporate Research and Development, Otto-Hahn-Ring 6, D-8000 Miinchen 83, FRG
fYear :
1987
fDate :
14-17 Sept. 1987
Firstpage :
829
Lastpage :
832
Abstract :
The results of constant voltage stress and constant injection current techniques are discussed concerning dielectric lifetimes and failure modes of a thermal oxide layer and a ONO-layer. The constant voltage stress shows that the ONO-layer has a prolonged lifetime and a lower amount of early failures compared to a single oxide layer, even though the charge to breakdown of the ONO-layer is smaller than that of the thermal oxide. From constant current stress experiments lifetimes for different dielectrics e.g. in a DRAM application can only be inferred in the case of similar electric fields.
Keywords :
Breakdown voltage; Capacitors; Dielectric breakdown; Dielectric films; Electrodes; Oxidation; Random access memory; Research and development; Silicon; Thermal stresses;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid State Device Research Conference, 1987. ESSDERC '87. 17th European
Conference_Location :
Bologna, Italy
Print_ISBN :
0444704779
Type :
conf
Filename :
5436752
Link To Document :
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