• DocumentCode
    514666
  • Title

    Holonic Supervisory Control and Data Acquisition for Heat Treating Process

  • Author

    Yu Hongbin ; Wu Hanxiang ; Qiao Yi

  • Author_Institution
    Sch. of Mech. & Electron. Eng., Tianjin Polytech. Univ., Tianjin, China
  • Volume
    2
  • fYear
    2010
  • fDate
    13-14 March 2010
  • Firstpage
    398
  • Lastpage
    401
  • Abstract
    Energy conservation and management continues to be of critical importance to the heat treating industry. With the cost of energy reaching record levels, the need to control what equipment is operating at proper temperature and what process specifications are ensured have become important factors in heat treating. With the analysis of holon the Holonic Supervisory Control and Data Acquisition (HSCADA) architecture is proposed. The approach is addressed to integrate systems in Small and Medium Enterprises (SME) of China when the use of commercial integrating software is reduced due to high cost and poor adaptability to SME from developing countries. The scope and advantages of this approach are discussed. Finally, a case study used in a used in small of heat treating workshop is presented to demonstrate the effectiveness of the proposed approach.
  • Keywords
    SCADA systems; control engineering computing; energy conservation; heat treatment; production engineering computing; production equipment; small-to-medium enterprises; China; commercial integrating software; energy conservation; energy management; heat treating process; heat treating workshop; holonic supervisory control and data acquisition; small and medium enterprise; Automation; Mechatronics; SCADA systems; Data Acquisition; Heat treating; Holon; SCADA;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Measuring Technology and Mechatronics Automation (ICMTMA), 2010 International Conference on
  • Conference_Location
    Changsha City
  • Print_ISBN
    978-1-4244-5001-5
  • Electronic_ISBN
    978-1-4244-5739-7
  • Type

    conf

  • DOI
    10.1109/ICMTMA.2010.174
  • Filename
    5458717