Title :
Discrete Dielectric Reflectarray and Lens for E-Band With Different Feed
Author :
Al-Nuaimi, Mustafa K. Taher ; Wei Hong
Author_Institution :
State Key Lab. of Millimeter waves, Southeast Univ., Nanjing, China
Abstract :
This letter presents the design and results of low-loss discrete dielectric flat reflectarray and lens for E-band. Using two different kinds of feed, 3-D-pyramidal (wideband) horn and 2 × 2 planar microstrip array (narrowband) antenna, the radiation performances of the two collimating structures are investigated. The discrete lens is optimized to cover the frequencies 71-86 GHz (71-76- and 81-86-GHz bands), while the discrete reflectarray is optimized to cover the 71-76-GHz band. The presented designs utilize the principle of perforated dielectric substrate using a square lattice of drilled holes of different radii and can be fabricated using standard printed circuit board (PCB) technology. The discrete lens has 41 × 41 unit cells and thickness of 6.35 mm, while the reflectarray has 40 × 40 unit cells and thickness of 3.24 mm. A good impedance matching ( |S11|<; -10 dB) and peak gain of 34 ±1 dB with maximum aperture efficiency of 44.6% are achieved over 71-86 GHz for the lens case. On the other hand, reflectarray with peak gain of 32 ±1 dB and aperture efficiency of 41.9% are achieved for 71-76-GHz band.
Keywords :
antenna feeds; impedance matching; lens antennas; millimetre wave antenna arrays; printed circuits; reflectarray antennas; 3D-pyramidal horn antenna; E-band; PCB technology; antenna feeds; collimating structures; discrete lens; drilled holes; efficiency 41.9 percent; frequency 71 GHz to 86 GHz; impedance matching; low-loss discrete dielectric flat reflectarray; perforated dielectric substrate; planar microstrip antenna array; printed circuit board; size 3.24 mm; size 6.35 mm; square lattice; Arrays; Dielectric losses; Horn antennas; Lenses; Microstrip; Microstrip antenna arrays; E-band communications; flat lens; reflectarray;
Journal_Title :
Antennas and Wireless Propagation Letters, IEEE
DOI :
10.1109/LAWP.2014.2313569