• DocumentCode
    516559
  • Title

    Contactless Testing for Chip Verification

  • Author

    Wolfgang, E. ; Görlich, S. ; Kölzer, J.

  • Author_Institution
    Siemens AG, Corporate Research and Development, Otto-Hahn-Ring 6, D-8000 Munich 83, Germany
  • Volume
    2
  • fYear
    1991
  • fDate
    11-13 Sept. 1991
  • Firstpage
    77
  • Lastpage
    82
  • Abstract
    A brief description is given on the state of the art of three contactless testing techniques: Electron-beam testing, laser-beam testing and emission microscopy. First, reasons are given why contactless testing is still important for chip verification and failure analysis. Second, a scenario of contactless testing describes the influences of chip, package and CAD/CAT environment. Finally requirements for contactless testing as well as design for e-beam testability are discussed.
  • Keywords
    Boundary conditions; Circuit testing; Contacts; Design automation; Design engineering; Electron microscopy; Failure analysis; Integrated circuit testing; Logic testing; Organizing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Circuits Conference, 1991. ESSCIRC '91. Proceedings - Seventeenth European
  • Conference_Location
    Milan, Italy
  • Type

    conf

  • Filename
    5468348
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=516559