• DocumentCode
    516683
  • Title

    Minimizing Mixed-Signal Coupling and Interaction

  • Author

    Schmerbeck, Timothy J.

  • Author_Institution
    IBM, AS/400 & Storage Systems Division, Rochester, Minnesota, U.S.A
  • fYear
    1994
  • fDate
    20-22 Sept. 1994
  • Firstpage
    28
  • Lastpage
    37
  • Abstract
    This paper surveys techniques and strategies aimed at minimizing electro-magnetic coupling and interaction on mixed-signal IC´s. Consideration is given to substrate coupling, power rail and i/o driver resonances, near field capacitive and inductive as well as package interaction and module level radiated emissions.
  • Keywords
    Circuit noise; Coupling circuits; Integrated circuit noise; Integrated circuit packaging; Low-frequency noise; Noise generators; Noise level; Semiconductor device noise; Substrates; Switching circuits;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Circuits Conference, 1994. ESSCIRC '94. Twentieth European
  • Conference_Location
    Ulm, Germany
  • Print_ISBN
    2-86332-160-9
  • Type

    conf

  • Filename
    5468521
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=516683