DocumentCode
516749
Title
A power-supply decoupling method for mixed-mode low voltage, low power integrated circuits
Author
Ingels, Mark ; Steyaert, Michiel
Author_Institution
Katholieke Universiteit Leuven, ESAT-MICAS, Kardinaal Mercierlaan 94, 3001 Heverlee - Belgium
fYear
1996
fDate
17-19 Sept. 1996
Firstpage
144
Lastpage
147
Abstract
This paper presents a decoupling method to achieve a good on chip power to ground decoupling with a low Q-factor. Unlike previously published methods, no resistor is added in the power supply path to reduce ringing so this method features no power voltage drop or power consumption, which makes it well suited for low voltage, low power applications.
Keywords
Bonding; Capacitance; Impedance; Inductance; Low voltage; Power integrated circuits; Power supplies; RLC circuits; Resistors; Resonance;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State Circuits Conference, 1996. ESSCIRC '96. Proceedings of the 22nd European
Conference_Location
Neuchatel, Switzerland
Print_ISBN
2-86332-197-8
Type
conf
Filename
5468612
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