DocumentCode :
516749
Title :
A power-supply decoupling method for mixed-mode low voltage, low power integrated circuits
Author :
Ingels, Mark ; Steyaert, Michiel
Author_Institution :
Katholieke Universiteit Leuven, ESAT-MICAS, Kardinaal Mercierlaan 94, 3001 Heverlee - Belgium
fYear :
1996
fDate :
17-19 Sept. 1996
Firstpage :
144
Lastpage :
147
Abstract :
This paper presents a decoupling method to achieve a good on chip power to ground decoupling with a low Q-factor. Unlike previously published methods, no resistor is added in the power supply path to reduce ringing so this method features no power voltage drop or power consumption, which makes it well suited for low voltage, low power applications.
Keywords :
Bonding; Capacitance; Impedance; Inductance; Low voltage; Power integrated circuits; Power supplies; RLC circuits; Resistors; Resonance;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State Circuits Conference, 1996. ESSCIRC '96. Proceedings of the 22nd European
Conference_Location :
Neuchatel, Switzerland
Print_ISBN :
2-86332-197-8
Type :
conf
Filename :
5468612
Link To Document :
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