• DocumentCode
    516749
  • Title

    A power-supply decoupling method for mixed-mode low voltage, low power integrated circuits

  • Author

    Ingels, Mark ; Steyaert, Michiel

  • Author_Institution
    Katholieke Universiteit Leuven, ESAT-MICAS, Kardinaal Mercierlaan 94, 3001 Heverlee - Belgium
  • fYear
    1996
  • fDate
    17-19 Sept. 1996
  • Firstpage
    144
  • Lastpage
    147
  • Abstract
    This paper presents a decoupling method to achieve a good on chip power to ground decoupling with a low Q-factor. Unlike previously published methods, no resistor is added in the power supply path to reduce ringing so this method features no power voltage drop or power consumption, which makes it well suited for low voltage, low power applications.
  • Keywords
    Bonding; Capacitance; Impedance; Inductance; Low voltage; Power integrated circuits; Power supplies; RLC circuits; Resistors; Resonance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Circuits Conference, 1996. ESSCIRC '96. Proceedings of the 22nd European
  • Conference_Location
    Neuchatel, Switzerland
  • Print_ISBN
    2-86332-197-8
  • Type

    conf

  • Filename
    5468612