DocumentCode :
518050
Title :
Notice of Retraction
The study of FEM model for micro-milling cutting performance
Author :
Lin, W.Y. ; Zheng, Y.H. ; Lee, B.Y.
Author_Institution :
Dept. of Mech. & Comput.-Aided Eng., Nat. Formosa Univ., Huwei, Taiwan
Volume :
2
fYear :
2010
fDate :
16-18 April 2010
Abstract :
Notice of Retraction

After careful and considered review of the content of this paper by a duly constituted expert committee, this paper has been found to be in violation of IEEE´s Publication Principles.

We hereby retract the content of this paper. Reasonable effort should be made to remove all past references to this paper.

The presenting author of this paper has the option to appeal this decision by contacting TPII@ieee.org.

This paper applied DEFORM software to construct a 2-D analysis model of micro-cutting SKD61 mold steel, by utilizing local grid to distinguish the shear zone between material and chips so that the grid could show a certain amount of quadrilaterals. Then, different cutting conditions were experimented to simulate orthogonal cutting and change the tool geometry (rake angle and relief angle), cutting velocity and cutting depth, and failure criteria were utilized to simulate material fracture. Lastly, FEM model was employed to simulate chip formation in micro-cutting, and the result was consistent with the actual milling. Therefore, the micro-cutting model constructed by FEM model could be used to perform micro-milling performance analysis.
Keywords :
cutting; finite element analysis; fracture; milling; 2D analysis model; DEFORM software; FEM model; material fracture; micromilling cutting performance; orthogonal cutting; shear zone; Building materials; Deformable models; Geometry; Milling; Performance analysis; Solid modeling; Steel; Finite Element Analysis; Micro-milling; SKD61 Mold Steel;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Computer Engineering and Technology (ICCET), 2010 2nd International Conference on
Conference_Location :
Chengdu
Print_ISBN :
978-1-4244-6347-3
Type :
conf
DOI :
10.1109/ICCET.2010.5485520
Filename :
5485520
Link To Document :
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