Title :
Notice of Retraction
Parameter optimization in magnetic abrasive polishing for magnesium plate
Author :
Jae-Seob Kwak ; Tae-Kyung Kwak
Author_Institution :
Sch. of Mech. Eng., Pukyong Nat. Univ., Busan, South Korea
Abstract :
Notice of Retraction
After careful and considered review of the content of this paper by a duly constituted expert committee, this paper has been found to be in violation of IEEE´s Publication Principles.
We hereby retract the content of this paper. Reasonable effort should be made to remove all past references to this paper.
The presenting author of this paper has the option to appeal this decision by contacting TPII@ieee.org.
This study aims to finish effectively the thin magnesium (AZ31) alloy plate that is usually very difficult to be polished by the conventional cutting processes because of their explosive and fragility properties. Reaction components on the workpiece surface roughness were measured after the magnetic abrasive polishing of the magnesium alloy plate. Taguchi experimental design method was adopted for evaluating the effect of the process parameters on the improvement of the surface roughness by the magnetic abrasive polishing. The process parameters were the applied current to the inductor, the working gap between the workpiece and the inductor, the rotational speed and the feed speed. Optimal conditions for better surface roughness were determined using the S/N ratio. As a result, it was seen that the magnetic abrasive polishing was very useful for finishing the thin magnesium alloy plate.
Keywords :
Taguchi methods; abrasion; design of experiments; magnesium alloys; optimisation; plates (structures); polishing; MgJkJk; Taguchi experimental design method; magnesium alloy plate; magnetic abrasive polishing; parameter optimization; process parameters; workpiece surface roughness; Abrasives; Design for experiments; Explosives; Feeds; Finishing; Inductors; Magnesium; Magnetic properties; Rough surfaces; Surface roughness; Taguchi method; magnesium plate; magnetic abrasive polishing; parameter optimization;
Conference_Titel :
Computer Engineering and Technology (ICCET), 2010 2nd International Conference on
Conference_Location :
Chengdu
Print_ISBN :
978-1-4244-6347-3
DOI :
10.1109/ICCET.2010.5486190