• DocumentCode
    522572
  • Title

    RLC interconnect modeling using delay algebraic equations

  • Author

    Roy, Sourajeet ; Dounavis, Anestis

  • fYear
    2009
  • fDate
    4-5 Oct. 2009
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    This paper presents a model for fast transient analysis for single line resistance-inductance-capacitance (RLC) on-chip interconnects. The proposed algorithm, based on a modified Lie formula, is used to convert the solution of the transmission line network into delay algebraic equations, which can be solved in a closed form manner. The proposed algorithm is not limited to fixed number of coupled RLC lines or to specific topologies and can be used to model both identical and non-identical multi-conductor lines and loads.
  • Keywords
    Lie algebras; RLC circuits; integrated circuit interconnections; integrated circuit modelling; transient analysis; Lie formula; RLC interconnect modeling; RLC on-chip interconnects; coupled RLC lines; delay algebraic equation; multiconductor lines; multiconductor loads; single line resistance-inductance-capacitance; transient analysis; transmission line network; Decision support systems; Delay; Equations; Virtual reality;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Circuits and Systems Workshop,(DCAS), 2009 IEEE Dallas
  • Conference_Location
    Richardson, TX
  • Print_ISBN
    978-1-4244-5483-9
  • Electronic_ISBN
    978-1-4244-5484-6
  • Type

    conf

  • DOI
    10.1109/DCAS.2009.5505769
  • Filename
    5505769