DocumentCode
522645
Title
Double-layer slotted waveguide array antennas with corporate-feed by diffusion bonding of laminated thin metal plates
Author
Hirokawa, Jiro ; Zhang, Miao ; Miura, Yohei ; Ando, Makoto
Author_Institution
Dept. of Electr. & Electron. Eng., Tokyo Inst. of Technol., Tokyo, Japan
fYear
2010
fDate
12-16 April 2010
Firstpage
1
Lastpage
5
Abstract
We demonstrate two types of double-layer slotted waveguide array antennas by diffusion bonding of laminated thin metal plates. Etching metal plates gives high precision at low cost and diffusion bonding gives perfect electrical connection in the slotted waveguide array, in millimeter-wave bands. Corporate feed is adopted to increase the bandwidth of a series-fed array antenna. A 38GHz antenna with partially corporate feed gives 73.2% peak efficiency with 33.9dBi at 38.5GHz in measurement at this moment. A 60GHz antenna with full corporate feed gives more than 32dBi and 80% efficiency over about a 5GHz bandwidth in measurement.
Keywords
Antenna accessories; Antenna arrays; Antenna feeds; Antenna measurements; Bandwidth; Costs; Diffusion bonding; Etching; Millimeter wave measurements; Slot antennas;
fLanguage
English
Publisher
ieee
Conference_Titel
Antennas and Propagation (EuCAP), 2010 Proceedings of the Fourth European Conference on
Conference_Location
Barcelona, Spain
Print_ISBN
978-1-4244-6431-9
Electronic_ISBN
978-84-7653-472-4
Type
conf
Filename
5505844
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