Title :
Detailed placement for leakage reduction using systematic through-pitch variation
Author :
Kahng, Andrew ; Muddu, S. ; Sharma, Parmanand
Author_Institution :
CSE Dept., Univ. of California at San Diego, San Diego, CA, USA
Abstract :
We present a novel detailed placement technique that accounts for systematic through-pitch variations to reduce leakage. Leakage depends nearly exponentially on linewidth (gate length), and even small variations in linewidth introduce large variability in leakage. A substantial fraction of linewidth variation is systematic with respect to the device layout context. Detailed placement changes context of the devices that are near the cell boundaries and can be used to reduce leakage. Our approach modifies the placement of cells in small windows such that contexts that reduce leakage are created. During this optimization, cells are partitioned into rows and then placed in rows using a traveling salesman problem formulation.
Keywords :
circuit optimisation; integrated circuit layout; leakage currents; travelling salesman problems; detailed placement technique; leakage reduction; systematic through-pitch variation; traveling salesman problem formulation; Delay; Design optimization; Integrated circuit technology; Lithography; Optical scattering; Permission; Routing; Subthreshold current; Temperature; Traveling salesman problems; aCLV; detailed placement; leakage; lithography; through-pitch;
Conference_Titel :
Low Power Electronics and Design (ISLPED), 2007 ACM/IEEE International Symposium on
Conference_Location :
Portland, OR
Electronic_ISBN :
978-1-59593-709-4
DOI :
10.1145/1283780.1283804