Title :
Research on Bond Graph Simulation for Dynamic Performance Analysis of MEMS
Author :
Liu, Yang ; Bao, Futing ; Cai, Qiang
Author_Institution :
Coll. of Astronaut., Northwestern Polytech. Univ., Xi´´an, China
Abstract :
Referring to the natures of nonlinear dynamics and coupled energy domains presented by Micro-Electro-Mechanical Systems (MEMS), a bond graph based coupled modeling and simulation methodology is put forward. With this method, the lumped sub models that consist of the multi-port field and junction structures of bond graphs are used to describe the behavior of micro components. Then, on the basis of the sub-models, a component template library (e.g. electro-thermal resistors, beams, plate masses, electrostatic gaps, and so on) for dynamic analysis also be established. According to the principle of conservation of energy, those simulation components can be used to construct the whole coupled micro systems by designers conveniently. At last, the correspondent software prototype is also developed. And taken a piezoelectric micro hydraulic transducer (MHT) as an example, the corresponding modeling processes and the simulation results prove that this bond graph modeling and simulation theory is quite effective for MEMS dynamic performance simulation.
Keywords :
graph theory; micromechanical devices; MEMS dynamic performance simulation; bond graph based coupled modeling; bond graph simulation; component template library; coupled energy domains; coupled microsystems; energy conservation; junction structures; lumped submodels; microelectromechanical systems; multiport field structure; nonlinear dynamics; piezoelectric microhydraulic transducer; simulation components; Analytical models; Bonding; Couplings; Electrostatic analysis; Microelectromechanical systems; Micromechanical devices; Performance analysis; Resistors; Software libraries; Software prototyping; MEMS; bond graph; coupled energy domain; modeling and simulation; multiport field and junction structures;
Conference_Titel :
Intelligent Computation Technology and Automation (ICICTA), 2010 International Conference on
Conference_Location :
Changsha
Print_ISBN :
978-1-4244-7279-6
Electronic_ISBN :
978-1-4244-7280-2
DOI :
10.1109/ICICTA.2010.560