• DocumentCode
    523796
  • Title

    BLoG: Post-Silicon bug localization in processors using bug localization graphs

  • Author

    Park, Sung-Boem ; Bracy, Anne ; Wang, Hong ; Mitra, Subhasish

  • Author_Institution
    Dept. of Electr. Eng., Stanford Univ., Stanford, CA, USA
  • fYear
    2010
  • fDate
    13-18 June 2010
  • Firstpage
    368
  • Lastpage
    373
  • Abstract
    Post-silicon bug localization - the process of identifying the location of a detected hardware bug and the cycle(s) during which the bug produces error(s) - is a major bottleneck for complex integrated circuits. Instruction Footprint Recording and Analysis (IFRA) is a promising post-silicon bug localization technique for complex processor cores. However, applying IFRA to new processor microarchitectures can be challenging due to the manual effort required to implement special microarchitecture-dependent analysis techniques for bug localization. This paper presents the Bug Localization Graph (BLoG) framework that enables application of IFRA to new processor microarchitectures with reduced manual effort. Results obtained from an industrial microarchitectural simulator modeling a state-of-the-art complex commercial microarchitecture (Intel Nehalem, the foundation for the Intel Core™ i7 and Core™ i5 processor families) demonstrate that BLoG-assisted IFRA enables effective and efficient post-silicon bug localization for complex processors with high bug localization accuracy at low cost.
  • Keywords
    microprocessor chips; security of data; IFRA technique; bug localization graphs; complex processor cores; instruction footprint recording and analysis; post-silicon bug localization; processor microarchitectures; Computer bugs; Computer science; Costs; Hardware; Information services; Internet; Manuals; Microarchitecture; Permission; Web sites; BLoG; IFRA; Silicon debug; post-silicon validation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design Automation Conference (DAC), 2010 47th ACM/IEEE
  • Conference_Location
    Anaheim, CA
  • ISSN
    0738-100X
  • Print_ISBN
    978-1-4244-6677-1
  • Type

    conf

  • Filename
    5523125