DocumentCode
524089
Title
Frequency planning for multi-core processors under thermal constraints
Author
Kadin, M. ; Reda, Sherief
Author_Institution
Div. of Eng., Brown Univ., Providence, RI, USA
fYear
2008
fDate
11-13 Aug. 2008
Firstpage
213
Lastpage
216
Abstract
The objectives of this paper are (1) to develop a frequency planning methodology that maximizes the total performance of multi-core processors and that limits their maximum temperature as specified by the design constraints; and (2) to establish the implications of technology scaling on the performance limits of multi-core processors. Given the intricate designs and workloads of multi or many-core processors, it is computationally exhaustive to develop models that accurately calculate the temperature and performance of a given processor under various operating conditions. To abstract the underlying design complexity, we propose the use of supervised machine learning techniques to develop versatile models that capture the thermal characterization of multi-core processors under various input conditions and workloads. We then use the developed models to create a framework where various design constraints and objectives are expressed and solved using combinatorial optimization techniques. Using established power modeling and thermal simulation tools, we show that it is possible to boost the performance of multi-core processors by up to 11.4% at no impact to the maximum temperature.
Keywords
design aids; learning (artificial intelligence); multiprocessing systems; optimisation; performance evaluation; thermal analysis; combinatorial optimization technique; design complexity; frequency planning methodology; multicore processor; power modeling; supervised machine learning technique; thermal characterization; thermal constraint; thermal simulation tool; Frequency; Multicore processing; Process planning; machine learning; multi-core processors; optimization; performance; temperature; thermal management;
fLanguage
English
Publisher
ieee
Conference_Titel
Low Power Electronics and Design (ISLPED), 2008 ACM/IEEE International Symposium on
Conference_Location
Bangalore
Print_ISBN
978-1-4244-8634-2
Electronic_ISBN
978-1-60558-109-5
Type
conf
DOI
10.1145/1393921.1393977
Filename
5529030
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