• DocumentCode
    524089
  • Title

    Frequency planning for multi-core processors under thermal constraints

  • Author

    Kadin, M. ; Reda, Sherief

  • Author_Institution
    Div. of Eng., Brown Univ., Providence, RI, USA
  • fYear
    2008
  • fDate
    11-13 Aug. 2008
  • Firstpage
    213
  • Lastpage
    216
  • Abstract
    The objectives of this paper are (1) to develop a frequency planning methodology that maximizes the total performance of multi-core processors and that limits their maximum temperature as specified by the design constraints; and (2) to establish the implications of technology scaling on the performance limits of multi-core processors. Given the intricate designs and workloads of multi or many-core processors, it is computationally exhaustive to develop models that accurately calculate the temperature and performance of a given processor under various operating conditions. To abstract the underlying design complexity, we propose the use of supervised machine learning techniques to develop versatile models that capture the thermal characterization of multi-core processors under various input conditions and workloads. We then use the developed models to create a framework where various design constraints and objectives are expressed and solved using combinatorial optimization techniques. Using established power modeling and thermal simulation tools, we show that it is possible to boost the performance of multi-core processors by up to 11.4% at no impact to the maximum temperature.
  • Keywords
    design aids; learning (artificial intelligence); multiprocessing systems; optimisation; performance evaluation; thermal analysis; combinatorial optimization technique; design complexity; frequency planning methodology; multicore processor; power modeling; supervised machine learning technique; thermal characterization; thermal constraint; thermal simulation tool; Frequency; Multicore processing; Process planning; machine learning; multi-core processors; optimization; performance; temperature; thermal management;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Low Power Electronics and Design (ISLPED), 2008 ACM/IEEE International Symposium on
  • Conference_Location
    Bangalore
  • Print_ISBN
    978-1-4244-8634-2
  • Electronic_ISBN
    978-1-60558-109-5
  • Type

    conf

  • DOI
    10.1145/1393921.1393977
  • Filename
    5529030