• DocumentCode
    524233
  • Title

    Jumping mechanism and simulation of the locust-like robot

  • Author

    Yong, Chen

  • Author_Institution
    Sch. of Mech. Eng., Dalian Jiaotong Univ., Dalian, China
  • Volume
    1
  • fYear
    2010
  • fDate
    22-24 June 2010
  • Abstract
    The geometrical configurations of the locust, Oedaleus infernalis, were obtained by using the stereomicroscope. The kinematics of the jumping process the locusts were analyzed from the high-speed photograph, and the jumping parameters of the locusts were gained. The characteristics of the locust during jumping were discussed. Kinematic analysis of the locust jumping provided critical 3D space point data for modeling and simulation. The dynamic model of the locust was established by the technology of virtual prototype. The displacement, velocity, acceleration and force of the locust during jumping were analyzed. According to the kinematic analysis of locust jump, a mechanical model was put forward to research the movement of the hind leg. The results showed that the model had the same advantages of low likelihood of premature lift-off and high efficiency as the locust. This work may provide the basic theory in developing locust-like robot in structural design. Besides, it provides an important reference to study the other bionic robots.
  • Keywords
    mobile robots; robot dynamics; robot kinematics; solid modelling; virtual prototyping; 3D space point data; Oedaleus infernalis; bionic robot; high-speed photograph; hind leg; jumping mechanism; jumping simulation; kinematic analysis; locust-like robot; robot kinematics; stereomicroscope; virtual prototype; Acceleration; Analytical models; Biological system modeling; Computer science education; Educational robots; Educational technology; Kinematics; Leg; Solid modeling; Space technology; Jumping robot; Kinematic analysis; Locust; Mechanical model; Simulation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Education Technology and Computer (ICETC), 2010 2nd International Conference on
  • Conference_Location
    Shanghai
  • Print_ISBN
    978-1-4244-6367-1
  • Type

    conf

  • DOI
    10.1109/ICETC.2010.5529297
  • Filename
    5529297