DocumentCode
531501
Title
Advanced polymers for advanced RF packaging applications
Author
Swaminathan, Madhavan ; Altunyurt, Nevin ; Hwang, Seunghyun
Author_Institution
Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
fYear
2010
fDate
28-30 Sept. 2010
Firstpage
695
Lastpage
698
Abstract
This paper presents advanced polymers for RF packaging applications including filters and antennas. First, micro-scaled LCP technology for front-end modules is presented. Next, nano-scaled ultra-thin RXP technology is introduced with its integration capability and embedded passive performances. Simulated results of bandpass filter, and antennas for 60 GHz are also presented in this paper. RXP technology provides low cost and promising high performance solution for wireless applications operating around microwave and millimeter frequencies. Magneto-dielectric substrates are proposed for effective miniaturization of antennas.
Keywords
antennas; band-pass filters; electronics packaging; liquid crystal polymers; substrates; RF packaging; advanced polymer; antennas; bandpass filter; frequency 60 GHz; front-end module; magneto-dielectric substrate; microscaled LCP technology; nanoscaled ultra-thin RXP technology;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Conference (EuMC), 2010 European
Conference_Location
Paris
Print_ISBN
978-1-4244-7232-1
Type
conf
Filename
5616370
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