The relevance of long-duration TLP stress on system level ESD design

An analysis of long-duration TLP stress will be performed on ESD clamps representative of the mo commonly used ESD protection strategies. It will be shown that snapback-based High Voltage devices feature static filamentary conduction after triggering. This leads to failure for TLP pulse widths in excess of 100ns, we below the expected power scaling levels. The need for long TLP testing to establish ESD protection robustness in the system level stress regime will be demonstrated.