DocumentCode :
533359
Title :
Improved ESD protection in advanced FDSOI by using hybrid SOI/bulk Co-integration
Author :
Benoist, Thomas ; Fenouillet-Beranger, Claire ; Guitard, Nicolas ; Huguenin, Jean-Luc ; Monfray, Stéphane ; Galy, Philippe ; Buj, Christel ; Andrieu, Francois ; Perreau, Pierre ; Marin-Cudraz, David ; Faynot, Olivier ; Cristoloveanu, Sorin ; Gentil, Pierr
Author_Institution :
STMicroelectronics Crolles, Crolles, France
fYear :
2010
fDate :
3-8 Oct. 2010
Firstpage :
1
Lastpage :
6
Abstract :
We investigate the influence of different technological parameters on ESD robustness in advanced FDSOI devices. From Transmission Line Pulse (TLP) measurements, a comparison with other technologies enables us to evaluate the impact of ultrathin film and buried oxide. A solution based on hybrid SOI/bulk co-integration by using Silicon-On-Nothing technology is presented in order to improve ultra-thin film ESD performance.
Keywords :
electrostatic discharge; pulse measurement; silicon-on-insulator; ESD protection; advanced FDSOI; buried oxide; fully depleted silicon on insulator technology; hybrid SOI-bulk cointegration; silicon-on-nothing technology; transmission line pulse measurements; ultrathin film; Conductivity; Electric fields; Electrostatic discharge; Leakage current; Logic gates; Robustness; Silicon;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Overstress/ Electrostatic Discharge Symposium (EOS/ESD), 2010 32nd
Conference_Location :
Reno, NV
Print_ISBN :
978-1-58537-182-2
Electronic_ISBN :
978-1-58537-182-2
Type :
conf
Filename :
5623728
Link To Document :
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