• DocumentCode
    533362
  • Title

    Investigation on output driver with stacked devices for ESD design window engineering

  • Author

    Cao, Shuqing ; Chun, Jung-Hoon ; Choi, Eunji ; Beebe, Stephen ; Anderson, Warren ; Dutton, Robert

  • Author_Institution
    Electr. Eng. Dept., Stanford Univ., Stanford, CA, USA
  • fYear
    2010
  • fDate
    3-8 Oct. 2010
  • Firstpage
    1
  • Lastpage
    8
  • Abstract
    This work investigates the ESD robustness of stacked drivers in bulk and SOI technologies. The impact of stacked driver sizing and pre-driver connection is examined in detail using VF-TLP and TLP measurement. It is shown that proper pre-driver configuration can double Vt2, thereby improving I/O´s It2.
  • Keywords
    driver circuits; electrostatic discharge; silicon-on-insulator; transmission lines; ESD design window engineering; SOI technology; TLP measurement; VF-TLP; output driver; stacked devices; stacked driver sizing; Clamps; Driver circuits; Electrostatic discharge; Integrated circuit interconnections; Logic gates; Transient analysis;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Overstress/ Electrostatic Discharge Symposium (EOS/ESD), 2010 32nd
  • Conference_Location
    Reno, NV
  • Print_ISBN
    978-1-58537-182-2
  • Electronic_ISBN
    978-1-58537-182-2
  • Type

    conf

  • Filename
    5623731
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=533362