• DocumentCode
    533547
  • Title

    Optimization of a thermal slip sensor using FEM and dimensional analysis

  • Author

    Accoto, Dino ; Francomano, Maria Teresa ; Benvenuto, Antonella ; Luccarelli, Ciro ; Guglielmelli, Eugenio

  • Author_Institution
    Lab. of Biomed. Robot. & Biomicrosystems, Univ. Campus Bio-Medico di Roma, Rome, Italy
  • fYear
    2010
  • fDate
    26-29 Sept. 2010
  • Firstpage
    855
  • Lastpage
    860
  • Abstract
    During manipulation tasks it is important to maintain a precise and safe control of the grasping force. Slip detection plays a key role to assure an adequate adaptation of the grasping force, without object damaging. Several approaches to slip detection are currently under investigation. In particular, thermal slip sensors use a detection strategy similar to the one employed in hot wire anemometry, using a microfabricated thermal probe for detecting the convective heat flux associated to the movement of the touched object. This paper reports on the model-based optimization of a thermal slip sensor, intended for robotic prosthesis. In particular, an analytical thermal model has been developed, by merging FEM and dimensional analysis. A sensitivity analysis, performed on the parameters appearing in the model, has been performed for optimizing both sensor´s geometry and materials in order to increase the heat flux and thereby to obtain a reduction of response times in the identification of slip. Simulations on the proposed design indicate an expected increase of the thermal dissipated power of about 400%.
  • Keywords
    bioMEMS; biosensors; convection; finite element analysis; medical robotics; microrobots; microsensors; optimisation; prosthetics; slip; FEM; convective heat flux; dimensional analysis; microsensor; optimization; robotic prosthesis; thermal dissipated power; thermal slip sensor; Heating; Materials; Resistors; Robot sensing systems; Temperature sensors; Thermal analysis; Thermal conductivity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Biomedical Robotics and Biomechatronics (BioRob), 2010 3rd IEEE RAS and EMBS International Conference on
  • Conference_Location
    Tokyo
  • ISSN
    2155-1774
  • Print_ISBN
    978-1-4244-7708-1
  • Type

    conf

  • DOI
    10.1109/BIOROB.2010.5626757
  • Filename
    5626757