DocumentCode
534340
Title
Mathematical and computing modeling of temperature fields in electronic modules
Author
Kandalov, Peter I. ; Madera, Alexander G.
Author_Institution
Sci.-Res. Inst. for Syst. Studies, Russian Acad. of Sci., Moscow, Russia
fYear
2010
fDate
6-8 Oct. 2010
Firstpage
1
Lastpage
3
Abstract
The article is devoted to mathematical and computing modelling of three-dimensional thermal fields in complicated electronics modules constructions with multilayer PCB and IC. The simulation technique is implemented as a program for PC.
Keywords
electronic engineering computing; integrated circuit modelling; integrated circuit packaging; mathematical analysis; modules; printed circuits; thermal management (packaging); PC program; computing modeling; electronic modules; mathematical modelling; multilayer IC; multilayer PCB; three-dimensional thermal field simulation;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal Investigations of ICs and Systems (THERMINIC), 2010 16th International Workshop on
Conference_Location
Barcelona
Print_ISBN
978-1-4244-8453-9
Type
conf
Filename
5636359
Link To Document