• DocumentCode
    535
  • Title

    Uncertainty Quantification in Prediction of the In-Plane Young´s Modulus of Thin Films With Fiber Texture

  • Author

    Madrid, Pedro J. ; Sulsky, Deborah ; Lebensohn, Ricardo A.

  • Author_Institution
    Dept. of Math. & Stat., Univ. of New Mexico, Albuquerque, NM, USA
  • Volume
    23
  • Issue
    2
  • fYear
    2014
  • fDate
    Apr-14
  • Firstpage
    380
  • Lastpage
    390
  • Abstract
    Electrodeposited thin films in MEMS devices often show fiber texture resulting in transverse isotropic, effective elastic properties. It is of interest to predict these elastic properties since they play a role in device performance. In addition to predicting effective material properties of the devices, we quantify the uncertainty in our predictions of these material properties for use in downstream simulations aimed at studies of performance, lifetime, or reliability. In this paper, we estimate the numerical value of the effective in-plane Young´s modulus of thin nickel polycrystalline films using numerical simulation. We also examine the variability and sensitivity of the in-plane Young´s modulus due to uncertainties in microstructure geometry, crystallographic texture, and numerical values of single-crystal elastic constants. The importance of accurate characterization of the texture is shown, as is the sensitivity of the effective in-plane Young´s modulus to single-crystal elastic moduli.
  • Keywords
    Young´s modulus; elastic constants; electrodeposition; electrodeposits; metallic thin films; micromechanical devices; nickel; texture; MEMS devices; Ni; Young´s modulus; crystallographic texture; effective material properties; elastic properties; electrodeposited thin films; fiber texture; microstructure geometry; numerical simulation; sensitivity; single crystal elastic constants; single crystal elastic moduli; thin nickel polycrystalline films; Crystals; Geometry; Microstructure; Strain; Tensile stress; Uncertainty; Young´s modulus; Crystallographic texture; Hill average; MEMS; Reuss; Voigt; experimental uncertainties; fiber texture; in-plane Young´s modulus;
  • fLanguage
    English
  • Journal_Title
    Microelectromechanical Systems, Journal of
  • Publisher
    ieee
  • ISSN
    1057-7157
  • Type

    jour

  • DOI
    10.1109/JMEMS.2013.2279500
  • Filename
    6589974