Title :
Atomistic Modeling of Pocket Dopant Deactivation and Its Impact on
Variation in Scaled Si Planar Devices Using an Atomistic Kinetic Monte Carlo Approach
Author :
Noda, Taiji ; Vrancken, Christa ; Vandervorst, Wilfried
Author_Institution :
Panasonic Corp., Osaka, Japan
Abstract :
An analysis of pocket dopant deactivation and its impact on Vth variation for scaled Si devices using an atomistic kinetic Monte Carlo approach are shown in this paper. B 5 keV, 5 × 1013/cm2 + As 1 keV, 1 × 1015/cm2 implants were used for B pocket deactivation study. An effect of laser annealing (LA) before spike-Rapid Thermal Annealing (RTA) was investigated. In case of B pocket implant, a stable B cluster configuration is changed from B3I (>1020 °C) to BI2 at spike-RTA temperature ~1020 °C. BI2 is a source of B pocket deactivation with lower temperature than 1020 °C. LA before low-temperature spike-RTA (<;1020 °C) is useful to improve B pocket activation. The Vth mismatch figure of merit extracted from Pelgrom plot (Avt) degradation in nFET is shown as spike-RTA temperature is reduced. LA before spike-RTA shows a better short channel effect with lower drain-induced barrier lowering in nFET. LA + spike-RTA at 1000 °C shows better Avt than spike-RTA-only. The difference of pocket deactivation is one of possible important reasons for the higher Vth mismatch for nFET than for pFET.
Keywords :
MOSFET; Monte Carlo methods; laser materials processing; rapid thermal annealing; semiconductor doping; semiconductor process modelling; FET; Pelgrom plot degradation; Si:B; atomistic kinetic Monte Carlo method; atomistic modeling; figure of merit; laser annealing; planar devices; pocket deactivation; pocket dopant deactivation; rapid thermal annealing; threshold voltage variation; Annealing; Implants; Junctions; Lasers; Semiconductor process modeling; Silicon; Temperature measurement; $V_{textrm {th}}$ variation; Diffusion; MOSFETs; Vth variation.; kinetic Monte Carlo (KMC); semiconductor; ultrashallow junctions (USJs);
Journal_Title :
Electron Devices, IEEE Transactions on
DOI :
10.1109/TED.2015.2419876