• DocumentCode
    53779
  • Title

    A 60-GHz Power Amplifier Design Using Dual-Radial Symmetric Architecture in 90-nm Low-Power CMOS

  • Author

    Jin-Fu Yeh ; Jeng-Han Tsai ; Tian-Wei Huang

  • Author_Institution
    Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
  • Volume
    61
  • Issue
    3
  • fYear
    2013
  • fDate
    Mar-13
  • Firstpage
    1280
  • Lastpage
    1290
  • Abstract
    An innovative on-chip 3-D power amplifier (PA) architecture for M-way power-combined CMOS PAs by using the proposed dual-radial symmetric architecture is presented. It provides design freedom of impedance selection of power device in transformer-based millimeter-wave PA design. This idea also makes distinguished breakthrough to the traditional 2-D PA architecture without compromising symmetry and compact size of layout. To demonstrate the feasibility of this idea, a 60-GHz PA is fabricated in 90-nm low-power CMOS process. It is also equipped with multi-mode operation. It achieves an output power of 18.5 dBm and a power-added efficiency of 10.2% with 1.2-V supply voltage. At 6-dB/10-dB power back-off operation, the drain efficiencies of power stage can be enhanced from 5.9%/2.4% to 11.9%/8%, respectively, by enabling the multi-mode operation.
  • Keywords
    CMOS integrated circuits; integrated circuit layout; low-power electronics; power amplifiers; dual-radial symmetric architecture; frequency 60 GHz; impedance selection; layout; low-power CMOS; multimode operation; on-chip 3-D power amplifier; transformer-based millimeter-wave power amplifier design; wavelength 90 nm; CMOS integrated circuits; CMOS technology; Impedance; Layout; Power combiners; Power generation; System-on-a-chip; 3-D power amplifier (PA) architecture; CMOS; dual-radial; folded-transformer; multi-mode operation; radial combining network; radial power distribution network;
  • fLanguage
    English
  • Journal_Title
    Microwave Theory and Techniques, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9480
  • Type

    jour

  • DOI
    10.1109/TMTT.2013.2243746
  • Filename
    6461114