• DocumentCode
    538269
  • Title

    Quality risk in global supply network

  • Author

    Tse, Ying Kei ; Kim Hua Tan

  • Author_Institution
    Bus. Sch., Nottingham Univ., Nottingham, UK
  • fYear
    2010
  • fDate
    6-9 Oct. 2010
  • Firstpage
    1
  • Lastpage
    7
  • Abstract
    The recent product recalls in Chinese made product and a series of product harm scandals ranging from milk powder to unsafe toy indicate that firms and consumers alike are vulnerable to quality risks in a global supply chain. Supply chains are extended by outsourcing and stretched by globalization, which greatly increases the complexity of supply network and decrease the visibility in risk and operation process. Thus, it is hard for firms to manage the product quality of such a multi-layer supply chain which has a low visibility of material origin. In this paper, we explore the issues of quality related risk in multi-tiered global supply chain, and argue that better visibility can improve firm risk management performance thus minimize the threat of product harm crisis. We also propose that adopting strategic supplier management with applying various risk management strategies on sourcing materials, could be utilized as effective mechanisms to improve performance of risk management and thus alleviate the impact of product harm risks to firms´ financial performance.
  • Keywords
    globalisation; outsourcing; quality management; risk management; strategic planning; supply chain management; Chinese made product; globalization; multilayer supply chain; multitiered global supply chain; outsourcing; product harm scandals; product quality; product recalls; quality risk management; strategic supplier management; Inspection; Manufacturing; Materials; Outsourcing; Risk management; Supply chains; Uncertainty; Global supply chain; Product harm scandal; Supply chain risk; Supply chain visibility;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Supply Chain Management and Information Systems (SCMIS), 2010 8th International Conference on
  • Conference_Location
    Hong Kong
  • Print_ISBN
    978-962-367-696-0
  • Type

    conf

  • Filename
    5681762