Overall Equipment Efficiency (OEE) improvements for lithographic tools in wafer fab

In contemporary worldwide semiconductor market, competitive advantage is achieved through offering high productivity and gets fast return on high capital investment. Must be pursued and explored improved method on Overall Equipment Efficiency (OEE). Lithographic tool is the one of highest capital tool, also being one of the most repeated processes, is an area where substantial improves can be made. Motivated by this challenge, we investigate the effects of various manufacturing and engineering efficiency loss for lithographic tools on OEE improvement. This paper will discuss two parts of improvement methods implemented.