DocumentCode :
539419
Title :
High reliable characteristics in manufacturing of MEMS Pressure Sensor
Author :
Zushi, Tetsuhiro ; Inaba, Yoshinori ; Sato, Ai ; Asai, Makoto
Author_Institution :
OMRON Corporation, 568 Matsuo Minakuchi-cho Koka-shi Shiga prefecture, 528-0074, Japan
fYear :
2008
fDate :
27-29 Oct. 2008
Firstpage :
327
Lastpage :
330
Abstract :
In order to achieve the high reliable characteristics of Capacitive Pressure Sensor, we have improved MEMS (Micro Electro Mechanical Systems) process in manufacturing which are constructed with the technology of micromachining process for Si substrate and the technology of anodic bonding process for Si diaphragm and fixed electrode glass. As the process conditions and the pattern design of a passivation SiO2 on metal electrode of the sensor have been optimized while preventing sticking failures in MEMS manufacturing, the solutions for elimination of Capacitance Drift failure of the sensor in humidity stress test has been proposed.
Keywords :
Electrodes; Humidity; Micromechanical devices; Passivation; Silicon; Sputtering; Surface morphology;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Manufacturing (ISSM), 2008 International Symposium on
Conference_Location :
Tokyo, Japan
ISSN :
1523-553X
Electronic_ISBN :
1523-553X
Type :
conf
Filename :
5714940
Link To Document :
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