High reliable characteristics in manufacturing of MEMS Pressure Sensor

In order to achieve the high reliable characteristics of Capacitive Pressure Sensor, we have improved MEMS (Micro Electro Mechanical Systems) process in manufacturing which are constructed with the technology of micromachining process for Si substrate and the technology of anodic bonding process for Si diaphragm and fixed electrode glass. As the process conditions and the pattern design of a passivation SiO2 on metal electrode of the sensor have been optimized while preventing sticking failures in MEMS manufacturing, the solutions for elimination of Capacitance Drift failure of the sensor in humidity stress test has been proposed.