Finite Element Analysis of Biaxial Scanning Device Based on Integrated Simulation Technique

Author

Minjian, Sheng ; Pengjun, Zhang ; Jing, Qian

Author_Institution

Shanghai Inst. of Tech. Phys., Shanghai, China

Volume

2

fYear

2011

fDate

6-7 Jan. 2011

Firstpage

217

Lastpage

220

Abstract

A thermal analysis was performed on a biaxial scanning device of a 3-axis stability satellite to get the temperature variations of the device. The temperature field, which represents worst working condition, was imported to a structural model as a set of boundary condition. A few optical parameters were separated from the deformation results of the structural analysis to evaluate the thermal controlling system inside the device, and furthermore to provide some useful design data.

Keywords

artificial satellites; boundary-elements methods; finite element analysis; structural engineering; thermal analysis; biaxial scanning device; boundary condition; finite element analysis; integrated simulation; stability satellite; structural analysis; structural model; thermal analysis; thermal controlling system; Boundary conditions; Computational modeling; Mirrors; Satellites; Shafts; Silicon carbide; Thermal analysis; 3-axis stability satellite; Integrated Simulation; biaxial scanning device;

fLanguage

English

Publisher

ieee

Conference_Titel

Measuring Technology and Mechatronics Automation (ICMTMA), 2011 Third International Conference on

Conference_Location

Shangshai

Print_ISBN

978-1-4244-9010-3

Type

conf

DOI

10.1109/ICMTMA.2011.342

Filename

5721160