Title :
Life Predict and Simulation of the Copper Wire in Flexible Printed Circuit Board
Author :
Wang, Hai-feng ; Yang, Ping ; Bao, Bi-zheng
Author_Institution :
Dept. of Mechatron. Eng., Univ. of Electron. Sci. & Technol. of China, Chengdu, China
Abstract :
Fatigue failure of the circuit board´s research focuses on the influence to the circuit board of vibration of rigid circuit board type, distribution of Electronic Components on the board etc. And there is relatively little research to the flexible circuit board´s fatigue life research. Local stress-strain method is used to predict the fatigue life. Simulate actual fatigue test load conditions to established finite element model of flexible printed circuit board. Perform fatigue analysis under the periodicity stress. Drawn fatigue life of copper wire in different loading conditions. There is guiding significance to the follow-up test.
Keywords :
circuit testing; fatigue; finite element analysis; printed circuits; copper wire simulation; electronic components; fatigue analysis; fatigue failure; finite element model; flexible circuit board fatigue life research; flexible printed circuit board; follow-up test; Fatigue; Load modeling; Materials; Printed circuits; Shafts; Strain; Stress; fatigue analysis; finite element simulation; flexible circuit board; life prediction;
Conference_Titel :
Measuring Technology and Mechatronics Automation (ICMTMA), 2011 Third International Conference on
Conference_Location :
Shangshai
Print_ISBN :
978-1-4244-9010-3
DOI :
10.1109/ICMTMA.2011.404
