Noise suppression using IC resin package filled with globular ferrite

To suppress noise generated by cellular phones, desktop personal computers, and other devices, sheets of materials with magnetic loss are often attached on the noise source (e.g., an IC). This paper presents a noise suppression method whereby newly developed globular magnetic ferrite is placed into an IC resin package to increase its density. We optimized factors such as the components, the shape of magnetic ferrite, and the filling rate. We then verified the practicality of the proposed method.